Siemens 6AG1195-7HC00-2XA0 SIPLUS ET 200M Active Bus Module

Part number

6AG1195-7HC00-2XA0

Brand

Siemens

Category

I/O Modules

Product type

I/O Modules

Lifecycle

Prod. Cancellation

Dimensions

10.00 x 10.00 x 6.8 cm

Net weight

0.117 Kg

• The device operates within an extended temperature range of -40 to +70 degrees Celsius. Keep dimensions 10.00 x 10.00 x 6.8 cm and net weight 0.117 Kg unchanged while comparing project documents and product image evidence.
• Startup functionality is confirmed down to a minimum temperature of -25 degrees Celsius.
• Conformal coating is applied to protect internal circuits against harsh industrial conditions effectively.
• The module is designed to hold I/O units that are exactly 80 mm in width.
• It features a removal and insertion function for convenient maintenance and module changes.
• Physical dimensions are recorded as 10.00 x 10.00 x 6.8 cm for space planning.

• The part number 6AG1195-7HC00-2XA0 identifies this specific SIPLUS variant of the ET 200M line. Use the source path io-modules to confirm catalog context, model family, parameter review scope, and technical inquiry preparation notes.
• It is derived from the base model 6ES7195-7HC00-0XA0 with added environmental protections.
• The SIPLUS designation indicates suitability for extreme ambient conditions beyond standard industrial norms.
• Lifecycle status is listed as Production Cancellation, requiring careful project timeline assessment.

Parameters are factual source fields retained for model review.

• Net weight is recorded at 0.117 Kg, which aids in logistics and mounting calculations. Check product-owned images, label text, connector area, and submitted model references against the exact 6AG1195-7HC00-2XA0 record before publication.
• The operating temperature span covers -40°C to +70°C for broad environmental applicability.
• Startup capability is verified at -25°C, ensuring reliability during cold initialization phases.
• Width accommodation is fixed at 80 mm for application context I/O module integration.
• Form factor dimensions are 10.00 x 10.00 x 6.8 cm for enclosure fitment.

• Visual inspection should confirm the presence of conformal coating on the circuit board. Review Siemens 6AG1195-7HC00-2XA0 as I/O Modules with source category io-modules, recorded lifecycle Prod. Cancellation, and submitted model identity.
• Check labeling for the exact part number 6AG1195-7HC00-2XA0 on the module housing.
• Verify physical connectors match the ET 200M series interface specifications accurately.
• Ensure no visible damage to the housing that might compromise environmental sealing integrity.

• Prepare project documentation specifying required temperature ranges for the intended installation environment. Keep dimensions 10.00 x 10.00 x 6.8 cm and net weight 0.117 Kg unchanged while comparing project documents and product image evidence.
• Confirm the need for 80 mm wide I/O module support in the system design.
• Review lifecycle status implications for long-term maintenance and supply chain planning strategies.
• Document specific environmental hazards to justify the selection of the SIPLUS coated version.

• Cross-reference the base model 6ES7195-7HC00-0XA0 for standard feature comparisons if needed.
• Assess the impact of the Production Cancellation status on future project scalability plans.
• Validate dimensional constraints against existing rack or panel mounting configurations thoroughly.
• Consider the extended temperature rating when evaluating suitability for outdoor or harsh sites.