
Siemens 6AG1193-6BP20-7BB1 Industrial Automation Component
This entry details the SIPLUS ET 200SP BU20-P12+A0+4B TYP B1 component manufactured by Siemens. The listing provides specific physical and operational parameters for engineering review.
Quick Facts
- Part number
- 6AG1193-6BP20-7BB1
- Brand
- Siemens
- Category
- I/O Modules
- Product type
- I/O Modules
- Lifecycle
- Active Product
- Dimensions
- 12.2 x 4.00 x 3.00 cm
- Net weight
- 0.057 Kg
- Source category
- SIPLUS BaseUnits
Product Overview
The Siemens 6AG1193-6BP20-7BB1 represents a specialized base unit within the ET 200SP series. It is designed for robust industrial environments requiring enhanced protection features.
This component integrates conformal coating to withstand challenging operational conditions. Engineers can utilize these specifications for detailed system architecture planning and evaluation.
Technical Review Notes
- The unit operates within a temperature range of -40 to +70 degrees Celsius. This wide thermal tolerance supports diverse industrial application scenarios effectively.
- Physical dimensions are recorded as 12.2 cm in width, 4.00 cm in depth, and 3.00 cm in height. These measurements assist in precise rack mounting calculations.
- The net weight of the component is listed at 0.057 kilograms. This lightweight characteristic facilitates easier handling during installation procedures.
- Terminal configuration utilizes push-in technology for secure electrical connections. This design choice aims to streamline wiring processes for maintenance teams.
- The base unit is bridged to the left side of the assembly. This specific bridging method ensures proper signal continuity within the module chain.
- Auxiliary terminals are not included in this specific model configuration. Users requiring additional auxiliary functions must plan for separate component integration.
Model Identification
- The product falls under the SIPLUS BaseUnits category within the ET 200SP family. This classification indicates specialized environmental hardening capabilities.
- The model is based on the standard 6ES7193-6BP20-0BB1 architecture. Modifications include specific enhancements for extreme condition performance and durability.
- BU type B1 designation identifies the specific form factor and interface layout. This code helps distinguish it from other base unit variations in the lineup.
- Conformal coating is applied to protect internal circuitry from moisture and contaminants. This feature is critical for harsh industrial environment reliability.
Technical Parameters
| Product type | I/O Modules |
|---|---|
| Lifecycle | Active Product |
| Dimensions | 12.2 x 4.00 x 3.00 cm |
| Net weight | 0.057 Kg |
| Source category | SIPLUS BaseUnits |
Parameters are factual source fields retained for model review.
Parameter Review
- Width and height measurements are specified as 20 mm x 117 mm for the module body. These compact dimensions optimize space utilization in control cabinets.
- The absence of AUX terminals defines the electrical interface scope for this unit. Designers should account for this limitation in schematic reviews.
- Push-in terminal technology requires specific tooling for wire insertion and removal. Proper installation techniques ensure long-term connection integrity and safety.
- Left-side bridging configuration affects the daisy-chain signal flow direction. Verify this orientation matches the overall system topology requirements before deployment.
Catalog Classification
Image & Label Review
- Visual inspection should confirm the presence of conformal coating on exposed surfaces. This coating provides essential protection against environmental degradation over time.
- Check the terminal block area for push-in mechanism alignment and condition. Ensuring mechanical integrity prevents loose connections during high-vibration operations.
- Examine the bridging contacts on the left side for proper engagement. Correct bridging is vital for maintaining communication bus stability across modules.
- Verify labeling clarity for part number and technical specification codes. Accurate identification aids in inventory management and future maintenance reference tasks.
Product Image Gallery

Inquiry Preparation
- Gather all relevant project documentation specifying environmental operating conditions. Include maximum and minimum temperature ranges expected in the installation location.
- Review system architecture diagrams to confirm base unit placement requirements. Ensure the selected model fits within the designated slot and bridging constraints.
- Prepare technical queries regarding interface application context with existing sensors. Clarify any specific wiring or termination needs for the push-in terminals.
- Document any special handling or storage requirements for the coated components. This information assists in logistics planning and preservation during transit.
Category Context
This item belongs to the broader I/O Modules category of industrial automation. Such components serve as critical interfaces between controllers and field devices.
The ET 200SP series is known for modular scalability and flexibility. Engineers often select these units for complex distributed control system designs.
Review Notes
- Confirm the active product lifecycle status before finalizing technical selections. Active status ensures continued support and documentation review details for the component.
- Cross-reference dimensions with cabinet space allocation plans for accuracy. Precise spatial planning prevents installation conflicts and ensures adequate cooling airflow.
- Validate temperature ratings against local site environmental monitoring data. Operating outside specified ranges may impact long-term component reliability and performance.
- Ensure all inquiry details match the specific model variant codes. Accurate part number verification prevents mismatches and delays in the inquiry preparation process.



