Siemens 6AG1155-6BA01-7CN0 SIPLUS ET 200SP Interface Module

Part number

6AG1155-6BA01-7CN0

Brand

Siemens

Category

I/O Modules

Product type

SIPLUS ET 200SP IM155-6DP HF based on 6ES7155-6BA01-0CN0 with conformal coating, -40…+70 °C, bundle PROFIBUS IM, max

Lifecycle

Active Product

Dimensions

12.2 x 8.00 x 6.00 cm

Net weight

0.234 Kg

Source category

SIPLUS interface modules

• The device operates within a temperature range of -40°C to +70°C, ensuring functionality in severe climates. Keep dimensions 12.2 x 8.00 x 6.00 cm and net weight 0.234 Kg unchanged while comparing project documents and product image evidence.
• Conformal coating is applied to protect internal components against moisture, dust, and corrosive substances effectively.
• The bundle supports a maximum of 32 I/O modules for extensive input and output signal handling.
• It also accommodates up to 16 ET 200AL modules to expand local I/O capabilities significantly.
• Multi-hot swap functionality allows for module changes without interrupting the overall system power supply.
• The physical dimensions are recorded as 12.2 x 8.00 x 6.00 cm with a net weight of 0.234 Kg.

• The base hardware corresponds to the 6ES7155-6BA01-0CN0 model with specific SIPLUS enhancements applied.
• The product lifecycle status is listed as Active Product, indicating current manufacturing and support review details.
• Classification B indicates review restrictions, requiring direct contact with designated Siemens review contacts for processing.
• The item falls under the Automation technology category, specifically within the ET 200SP product line.

Parameters are factual source fields retained for model review.

• Review the bundle contents which consist of the interface module 6AG1155-6BU01-7CN0 for primary connectivity.
• Verify the inclusion of the server module 6AG1193-6PA00-7AA0 to ensure proper data routing capabilities.
• Confirm the presence of the PROFIBUS plug as part of the standard package for network connection.
• Check the dimensional constraints against your rack space requirements given the compact 12.2 cm width.
• Note the weight specification of 0.234 Kg for logistics planning and mounting load calculations.

• Images typically display the front panel with status LEDs indicating operational state and communication links.
• Side views may show the DIN rail mounting clip mechanism used for secure installation procedures.
• Bundle packaging images often illustrate the separate components included in the complete interface assembly.
• Label close-ups help verify the part number and serial information printed on the housing surface.

• Prepare your project documentation specifying the required operating temperature range for the installation environment.
• List the total number of I/O modules needed to ensure the bundle capacity meets demands.
• Identify the specific PROFIBUS network topology to confirm application context with the included server module type.
• Gather any special environmental factors like chemical exposure that necessitate the conformal coating feature.

• Ensure all bundle components are accounted for during the initial receipt and inspection phase.
• Cross-reference the technical data sheet for detailed electrical specifications before final integration planning.
• Consult the review note guidelines due to the Class B restriction on this specific product type.
• Validate the active product status to confirm ongoing technical support and documentation review details for engineers.